September 3rd, 2024, Taipei, Taiwan – v-color Technology Inc. is set to revolutionize the future of memory technology with the launch of the world’s first RGB DDR5 O CUDIMM (High Speed Overclocked CUDIMM). This groundbreaking innovation for the next-generation desktop platform, offering unmatched speeds and efficiency for desktop applications. This memory module has a new heatsink patent (Patent No. 113208127) to increase heat dissipation efficiency to a new level, and the introduction of the exclusive light guide rod patented coating technology (Patent No. M653290) allows the light guide rod to attract attention regardless of whether it has RGB effects or not.
CUDIMM Technology
The DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) technology dynamically adjusts clock frequency and voltage based on workload and system conditions. This cutting-edge capability results in faster data transmission, lower power consumption, and enhanced stability, making it a game-changer in the industry.
World's First DDR5 Overclocked RGB O CUDIMM 9200MT/s+ Memory
The new v-color RGB O CUDIMM (High Speed Overclocked CUDIMM) memory modules are available in capacities of 32GB (2x16GB) and 48GB (2x24GB), with standard speeds starting at 6400MT/s and reaching overclocked speeds of 9200MT/s+. Designed for gamers, content creators, and professionals who demand top-tier performance, these modules ensure you can push the limits of your system with ease. The integration of XMP profiles further simplifies the overclocking process, unlocking your system’s full potential effortlessly.
XFinity Series Red Dot Award Winner 2024
These RGB O CUDIMM modules will be part of the Red Dot award-winning design 2024 XFinity series, known for its superior design and performance. The modules are available in black with a gold RGB bar and black with a silver RGB bar, combining aesthetics with functionality to deliver a truly immersive experience.
Innovative Cooling Solution
To address the challenges of high-performance computing, v-color has developed an advanced heatsink with an innovative inside fitting back design. This custom mold is tailored to fit individual memory chips more effectively (Patent No. 113208127), resulting in better cooling performance. The original flat heatsink design, which used 3M double-sided thermal conductivity of 0.9 W/mK, was tested to maintain a temperature of approximately 86 degrees Celsius.
The new heatsink features two cuboids with a thickness of 0.8mm directly integrated into the mold. This design allows the heatsink to closely adhere to the memory chips, enhancing heat dissipation. Instead of traditional double-sided tape, v-color employs a high-performance 0.2mm heat dissipation patch with a thermal conductivity of 2.5 W/mK. During assembly, this patch is compressed to 0.1mm, significantly improving thermal management.
Remarkable Temperature Reduction
Testing of this advanced cooling solution shows a temperature drop of about 2~5% degrees overall. This result is nearly on par with the heat dissipation performance of bare memory strips, which are known for their superior cooling capabilities due to the absence of any covering. With this innovative release, v-color Technology Inc. continues to lead the industry in pioneering advancements, offering products that redefine what’s possible in computing.
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